Semiconductor
Implements maximum efficiency production system of semiconductor production process
01
SEMI OHT (Overhead Hoist Transport)
Use
安装在Rail底部的半导体工程间物流运送系统
Features
- Minimum Turning Radius
- Dual Rail Track
- OHS & OHT Port Access
- Active Slide Architecture
- Compact & Slim Design
Specification
- TypeFOUP, FOSB, Megazine, Tray, Cassette
- Payload8~20Kg
- SpeedStraight 3.5m/sec, Curve 0.7m/sec
- Elevator Speed0.9m/sec
- Curve RadiusR500mm (45˚, 90 ˚)
- CleanlinessClass 10@0.3㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
02
SEMI STOCKER
Use
是工程间物流搬送设备,具有FOUP的保管及运送功能
Features
- Superior Cycle Time
- Flexible Port Configuration
- Optimize Safety Interlock
- Contact-less Power Supply
Specification
- PayloadFOUP, FOSB, Cassette, Megazine, Tray
- Movement AxesX-axis, Z-axis, Turning, Forking
- Forking TimeForking Time: 2 sec
- CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
03
Bank STOCKER
Use
Wafer Test- Bank(Wafer sorting / Split, Merge)
- Storing & transport t in bank process during PKG&Test
Features
- Twin S-Master
- Storing over 1,000 cell
- Sorter Docking
Specification
- PayloadFOUP, FOSB
- Movement AxesX-axis, Z-axis, Turning, Forking
- Tact Time12 sec (Forking Time: 2 sec)
- CleanlinessClass 10@0.3㎛(Anti-Particle Design)
04
SEMI AGV (Automated Guided Vehicle)
Use
在半导体工程中, 把FOUP及Cassette 等运送物品自动运送到 Stocker 或EQ的设备
Features
- Excellent & Flexible Delivery System
- Direct Interface with Process Equip or Buffers
Specification
- PayloadMax. 20Kg
- Use to Handle TypeFOUP, FOSB, Cassette, Megazine, Tray, etc.
- Load/Unloading Time25~30sec
- Traveling VelocityMax. 56m/min
- CleanlinessClass 10@0.1㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
05
MCS (Material Control System)
Use
通过探索物流设备间最佳路径,控制从MES收到的转运命令,对个别物流设备的转运进行实时监控,实现Full Automation
Features
- 对工程内AMHS 装备及 Material实时监控
- 支持SEMI的标准(SECS, GEM, Stocker-SEM, IB-SEM)
- 根据工程的状况有效Dynamic Routing
- 适用最佳运送路径探索(Shortest Path)算法
- 为分散负荷的 Load Balancing
- OS内独立的 J2EE Platform
- Run-Time Patch
- Active-Active的结构, 可对应 Auto Failover
- 支持多样的DBMS 及 Middleware
Specification
- 对应设备OHT, Stocker, OHB, Lift, AGV
- ProtocolIB-SEM / Stocker-SEM
- AutoFailoverActive-Active
- Business LogicBPEL
- 扩展性多样的 Host / AMHS结合方便
06
SEMI HT (High Speed Tower)
Use
安装在半导体工程中有层间或段差区域, 把FOUP上下运送的设备
Features
- Double Transport(2 FOUP) System
- Short Cycle Time
- Fast Moving Speed
- Fast Cargo(FOUP, FOSB) System Between Multi Floor
Specification
- Payload300mm FOUP, FOSB
- Height25 ~ 60m
- Up/Down SpeedMax. 250m/min
- CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
07
Conveyor
Use
FOUP及卡匣水平运送的设备, 且当Buffer可以装载物品的物流系统 System
Features
- Flexible with Module Unit
- Dual Belt for Minimum Tray Contact
- Miniaturization / weight lightening
Specification
- Driving MethodInduction Motor / Inverter Control
- SpeedMax. 30m/min
- Drive(Turn)Servo Motor
- Turn Speed 5sec / 90º, 8sec / 180º
- Traveling Speed 15sec @ Stroke 1435mm
LHT (Local Hoist Transfer)
Use
半导体工程中EQ跟EQ间直线区域上运送的设备
Features
- Simple
- Speedy Tact Time
Specification
- PayloadFOUP, FOSB, M/Z, Tray, Cassette
- Travel Speed2m/sec
- Elevator Speed 0.48m/sec
- CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
SIS (Sorter In STOCKER)
Use
- FOUP / FOSB Wafer Split, Merge function is included
Features
- Minimized Lay-Out composition is available
(Square shape / Sorter 2 unit composition)
Specification
- PayloadFOUP, FOSB
- Movement AxesX-axis, Z-axis, Turning, Forking
- Tact TimeForking Time: 2 sec
- CleanlinessClass 10@0.3㎛(Anti-Particle Design)
FIO (FOUP In Out System)
Use
System for in / out the product (FOUP, FOSB) from OHT
Features
- Minimized Lay-Out composition is available
(800mm × 800mm) - Easy to move
Specification
- PayloadFOUP, FOSB
- Movement AxesX-axis, Turning
- Speed0.25m/sec
- CleanlinessClass 10@0.3㎛(Anti-Particle Design)