SYNUS Tech

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事业领域
作为通过独自技术开发具备国际竞争力的企业, 将面向未来走向世界

Semiconductor

Implements maximum efficiency production system of semiconductor production process

01

SEMI OHT (Overhead Hoist Transport)

Use

安装在Rail底部的半导体工程间物流运送系统

Features

  • Minimum Turning Radius
  • Dual Rail Track
  • OHS & OHT Port Access
  • Active Slide Architecture
  • Compact & Slim Design

Specification

  • TypeFOUP, FOSB, Megazine, Tray, Cassette
  • Payload8~20Kg
  • SpeedStraight 3.5m/sec, Curve 0.7m/sec
  • Elevator Speed0.9m/sec
  • Curve RadiusR500mm (45˚, 90 ˚)
  • CleanlinessClass 10@0.3㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)
02

SEMI STOCKER

Use

是工程间物流搬送设备,具有FOUP的保管及运送功能

Features

  • Superior Cycle Time
  • Flexible Port Configuration
  • Optimize Safety Interlock
  • Contact-less Power Supply

Specification

  • PayloadFOUP, FOSB, Cassette, Megazine, Tray
  • Movement AxesX-axis, Z-axis, Turning, Forking
  • Forking TimeForking Time: 2 sec
  • CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)
03

SEMI HT (High Speed Tower)

Use

安装在半导体工程中有层间或段差区域, 把FOUP上下运送的设备

Features

  • Double Transport(2 FOUP) System
  • Short Cycle Time
  • Fast Moving Speed
  • Fast Cargo(FOUP, FOSB) System Between Multi Floor

Specification

  • Payload300mm FOUP, FOSB
  • Height25 ~ 60m
  • Up/Down SpeedMax. 250m/min
  • CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)
04

Conveyor

Use

FOUP及卡匣水平运送的设备, 且当Buffer可以装载物品的物流系统 System

Features

  • Flexible with Module Unit
  • Dual Belt for Minimum Tray Contact
  • Miniaturization / weight lightening

Specification

  • Driving MethodInduction Motor / Inverter Control
  • SpeedMax. 30m/min
  • Drive(Turn)Servo Motor
  • Turn Speed 5sec / 90º, 8sec / 180º
  • Traveling Speed 15sec @ Stroke 1435mm
05

MCS (Material Control System)

Use

通过探索物流设备间最佳路径,控制从MES收到的转运命令,对个别物流设备的转运进行实时监控,实现Full Automation

Features

  • 对工程内AMHS 装备及 Material实时监控
  • 支持SEMI的标准(SECS, GEM, Stocker-SEM, IB-SEM)
  • 根据工程的状况有效Dynamic Routing
  • 适用最佳运送路径探索(Shortest Path)算法
  • 为分散负荷的 Load Balancing
  • OS内独立的 J2EE Platform
  • Run-Time Patch
  • Active-Active的结构, 可对应 Auto Failover
  • 支持多样的DBMS 及 Middleware

Specification

  • 对应设备OHT, Stocker, OHB, Lift, AGV
  • ProtocolIB-SEM / Stocker-SEM
  • AutoFailoverActive-Active
  • Business LogicBPEL
  • 扩展性多样的 Host / AMHS结合方便
06

SEMI AGV (Automated Guided Vehicle)

Use

在半导体工程中, 把FOUP及Cassette 等运送物品自动运送到 Stocker 或EQ的设备

Features

  • Excellent & Flexible Delivery System
  • Direct Interface with Process Equip or Buffers

Specification

  • PayloadMax. 20Kg
  • Use to Handle TypeFOUP, FOSB, Cassette, Megazine, Tray, etc.
  • Load/Unloading Time25~30sec
  • Traveling VelocityMax. 56m/min
  • CleanlinessClass 10@0.1㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)
07

LHT (Local Hoist Transfer)

Use

半导体工程中EQ跟EQ间直线区域上运送的设备

Features

  • Simple
  • Speedy Tact Time

Specification

  • PayloadFOUP, FOSB, M/Z, Tray, Cassette
  • Travel Speed2m/sec
  • Elevator Speed 0.48m/sec
  • CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)
08

Bank STOCKER

Use

Wafer Test
  • Bank(Wafer sorting / Split, Merge)
  • Storing & transport t in bank process during PKG&Test

Features

  • Twin S-Master
  • Storing over 1,000 cell
  • Sorter Docking

Specification

  • PayloadFOUP, FOSB
  • Movement AxesX-axis, Z-axis, Turning, Forking
  • Tact Time12 sec (Forking Time: 2 sec)
  • CleanlinessClass 10@0.3㎛(Anti-Particle Design)
09

SIS (Sorter In STOCKER)

Use

  • FOUP / FOSB Wafer Split, Merge function is included

Features

  • Minimized Lay-Out composition is available
    (Square shape / Sorter 2 unit composition)

Specification

  • PayloadFOUP, FOSB
  • Movement AxesX-axis, Z-axis, Turning, Forking
  • Tact TimeForking Time: 2 sec
  • CleanlinessClass 10@0.3㎛(Anti-Particle Design)
10

FIO (FOUP In Out System)

Use

System for in / out the product (FOUP, FOSB) from OHT

Features

  • Minimized Lay-Out composition is available
    (800mm × 800mm)
  • Easy to move

Specification

  • PayloadFOUP, FOSB
  • Movement AxesX-axis, Turning
  • Speed0.25m/sec
  • CleanlinessClass 10@0.3㎛(Anti-Particle Design)