반도체
반도체 생산공정의 최대 효율 생산 시스템 구현합니다.
01
SEMI OHT (Overhead Hoist Transport)
Use
Rail 하부에 설치된 반도체 공정간 물류 이송 시스템
Features
- Minimum Turning Radius
- Dual Rail Track
- OHS & OHT Port Access
- Active Slide Architecture
- Compact & Slim Design
Specification
- TypeFOUP, FOSB, Megazine, Tray, Cassette
- Payload8~20Kg
- SpeedStraight 3.5m/sec, Curve 0.7m/sec
- Elevator Speed0.9m/sec
- Curve RadiusR500mm (45˚, 90 ˚)
- CleanlinessClass 10@0.3㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
02
SEMI STOCKER
Use
공정간 물류 이송시스템으로 FOUP의 보관 및 이송기능 담당
Features
- Superior Cycle Time
- Flexible Port Configuration
- Optimize Safety Interlock
- Contact-less Power Supply
Specification
- PayloadFOUP, FOSB, Cassette, Megazine, Tray
- Movement AxesX-axis, Z-axis, Turning, Forking
- Forking TimeForking Time: 2 sec
- CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
03
Bank STOCKER
Use
Wafer Test- Bank(Wafer sorting / Split, Merge)
- Storing & transport t in bank process during PKG&Test
Features
- Twin S-Master
- Storing over 1,000 cell
- Sorter Docking
Specification
- PayloadFOUP, FOSB
- Movement AxesX-axis, Z-axis, Turning, Forking
- Tact Time12 sec (Forking Time: 2 sec)
- CleanlinessClass 10@0.3㎛(Anti-Particle Design)
04
SEMI AGV (Automated Guided Vehicle)
Use
반도체 공정 중 FOUP, Cassette 등의 반송물을 Stocker와 EQ 장비에 자동으로 반송하는 장비
Features
- Excellent & Flexible Delivery System
- Direct Interface with Process Equip or Buffers
Specification
- PayloadMax. 20Kg
- Use to Handle TypeFOUP, FOSB, Cassette, Megazine, Tray, etc.
- Load/Unloading Time25~30sec
- Traveling VelocityMax. 56m/min
- CleanlinessClass 10@0.1㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
05
MCS (Material Control System)
Use
MES로부터 수신한 이송명령을 물류설비간 최적 경로 탐색하여 개별 물류 설비의 이송을 제어 이송에 대한 실시간 모니터링을 통해 Full Automation을 구현
Features
- AMHS 장비 및 Material 에 대한 공장내 이송 장비의 실시간 모니터링
- SEMI 표준 지원 (SECS, GEM, Stocker-SEM, IB-SEM)
- 공장 상황에 따른 효율적인 Dynamic Routing
- 최적의 이송 경로 탐색(Shortest Path) 알고리즘 적용
- 부하 분산을 위한 Load Balancing
- OS에 독립적인 J2EE Platform
- Run-Time Patch
- Active-Active 구조로 Auto Failover 대처
- 다양한 DBMS 및 Middleware 지원
Specification
- 대응 장비OHT, Stocker, OHB, Lift, AGV
- 기반 프로토콜IB-SEM / Stocker-SEM
- Auto FailoverActive-Active
- Business LogicBPEL 기반
- 확장성다양한 Host / AMHS와 통합 용이
06
SEMI HT (High Speed Tower)
Use
반도체 공정 중 층간 또는 층 내 단차가 있는 곳에서 FOUP을 수직 반송해 주는 장비
Features
- Double Transport(2 FOUP) System
- Short Cycle Time
- Fast Moving Speed
- Fast Cargo(FOUP, FOSB) System Between Multi Floor
Specification
- Payload300mm FOUP, FOSB
- Height25 ~ 60m
- Up/Down SpeedMax. 250m/min
- CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
07
Conveyor
Use
FOUP, Cassette 등을 수평으로 이송하며 Buffer로써 적재도 가능한 물류 System
Features
- Flexible with Module Unit
- Dual Belt for Minimum Tray Contact
- Miniaturization / weight lightening
Specification
- Driving MethodInduction Motor / Inverter Control
- SpeedMax. 30m/min
- Drive(Turn)Servo Motor
- Turn Speed 5sec / 90º, 8sec / 180º
- Traveling Speed 15sec @ Stroke 1435mm
LHT (Local Hoist Transfer)
Use
반도체 공정 중 EQ 에서 EQ 구간의 직선 구간을 반송하는 OHT와는 달리 Rail 구성이 간단
Features
- Simple
- Speedy Tact Time
Specification
- PayloadFOUP, FOSB, M/Z, Tray, Cassette
- Travel Speed2m/sec
- Elevator Speed 0.48m/sec
- CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
Pkg- Class 1000@0.5㎛(Anti-Particle Design)
SIS (Sorter In STOCKER)
Use
- FOUP / FOSB Wafer Split, Merge function is included
Features
- Minimized Lay-Out composition is available
(Square shape / Sorter 2 unit composition)
Specification
- PayloadFOUP, FOSB
- Movement AxesX-axis, Z-axis, Turning, Forking
- Tact TimeForking Time: 2 sec
- CleanlinessClass 10@0.3㎛(Anti-Particle Design)
FIO (FOUP In Out System)
Use
System for in / out the product (FOUP, FOSB) from OHT
Features
- Minimized Lay-Out composition is available
(800mm × 800mm) - Easy to move
Specification
- PayloadFOUP, FOSB
- Movement AxesX-axis, Turning
- Speed0.25m/sec
- CleanlinessClass 10@0.3㎛(Anti-Particle Design)