SYNUS Tech

본문 바로가기
nav open
Business Field
As a company with international competitiveness through independent technology development,
we will expand to the world

Semiconductor

Implements maximum efficiency production system of semiconductor production process

01

SEMI OHT (Overhead Hoist Transport)

Use

Material transport system between semiconductor processes installed under the rail

Features

  • Minimum Turning Radius
  • Dual Rail Track
  • OHS & OHT Port Access
  • Active Slide Architecture
  • Compact & Slim Design

Specification

  • TypeFOUP, FOSB, Megazine, Tray, Cassette
  • Payload8~20Kg
  • SpeedStraight 3.5m/sec, Curve 0.7m/sec
  • Elevator Speed0.9m/sec
  • Curve RadiusR500mm (45˚, 90 ˚)
  • CleanlinessClass 10@0.3㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)
02

SEMI STOCKER

Use

Inter-process material transport system with FOUP storage and transport function

Features

  • Superior Cycle Time
  • Flexible Port Configuration
  • Optimize Safety Interlock
  • Contact-less Power Supply

Specification

  • PayloadFOUP, FOSB, Cassette, Megazine, Tray
  • Movement AxesX-axis, Z-axis, Turning, Forking
  • Forking TimeForking Time: 2 sec
  • CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)
03

Bank STOCKER

Use

Wafer Test
  • Bank(Wafer sorting / Split, Merge)
  • Storing & transport t in bank process during PKG&Test

Features

  • Twin S-Master
  • Storing over 1,000 cell
  • Sorter Docking

Specification

  • PayloadFOUP, FOSB
  • Movement AxesX-axis, Z-axis, Turning, Forking
  • Tact Time12 sec (Forking Time: 2 sec)
  • CleanlinessClass 10@0.3㎛(Anti-Particle Design)
04

SEMI AGV (Automated Guided Vehicle)

Use

Equipment that automatically conveys conveyed goods such as FOUP, Cassette, etc. to Stocker and EQ equipment during semiconductor process

Features

  • Excellent & Flexible Delivery System
  • Direct Interface with Process Equip or Buffers

Specification

  • PayloadMax. 20Kg
  • Use to Handle TypeFOUP, FOSB, Cassette, Megazine, Tray, etc.
  • Load/Unloading Time25~30sec
  • Traveling VelocityMax. 56m/min
  • CleanlinessClass 10@0.1㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)
05

MCS (Material Control System)

Use

By finding the shortest path between material facilities received from MES, it’s to realize full automation through real-time monitoring of control transport of each material facility

Features

  • Real-time monitor in-house transport equipment for AMHS equipment and materials
  • Support SEMI standard (SECS, GEM, Stocker-SEM, IB-SEM)
  • Efficient Dynamic Routing according to factory state
  • Apply the Shortest Path
  • Load Balancing
  • J2EE Platform independent on OS
  • Run-Time Patch
  • Respond to Auto Failover Active-Active structure
  • Support various DBMS and Middleware

Specification

  • Correspondence equipmentOHT, Stocker, OHB, Lift, AGV
  • based protocolIB-SEM / Stocker-SEM
  • Auto FailoverActive-Active
  • Business LogicBPEL-based
  • ScalabilityEasy integration with various Host / AMHS
06

SEMI HT (High Speed Tower)

Use

Equipment that vertically conveys FOUP at inter- or intra-layer level during the semiconductor process

Features

  • Double Transport(2 FOUP) System
  • Short Cycle Time
  • Fast Moving Speed
  • Fast Cargo(FOUP, FOSB) System Between Multi Floor

Specification

  • Payload300mm FOUP, FOSB
  • Height25 ~ 60m
  • Up/Down SpeedMax. 250m/min
  • CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)
07

Conveyor

Use

Material system that transports FOUP, Cassette, etc. horizontally and can also load them as a buffer

Features

  • Flexible with Module Unit
  • Dual Belt for Minimum Tray Contact
  • Miniaturization / weight lightening

Specification

  • Driving MethodInduction Motor / Inverter Control
  • SpeedMax. 30m/min
  • Drive(Turn)Servo Motor
  • Turn Speed 5sec / 90º, 8sec / 180º
  • Traveling Speed 15sec @ Stroke 1435mm

LHT (Local Hoist Transfer)

Use

Unlike OHT, which conveys linear section of EQ section from EQ in the semiconductor processes, rail configuration is simple

Features

  • Simple
  • Speedy Tact Time

Specification

  • PayloadFOUP, FOSB, M/Z, Tray, Cassette
  • Travel Speed2m/sec
  • Elevator Speed 0.48m/sec
  • CleanlinessFab -Class 10@0.3㎛(Anti-Particle Design)
    Pkg- Class 1000@0.5㎛(Anti-Particle Design)

SIS (Sorter In STOCKER)

Use

  • FOUP / FOSB Wafer Split, Merge function is included

Features

  • Minimized Lay-Out composition is available
    (Square shape / Sorter 2 unit composition)

Specification

  • PayloadFOUP, FOSB
  • Movement AxesX-axis, Z-axis, Turning, Forking
  • Tact TimeForking Time: 2 sec
  • CleanlinessClass 10@0.3㎛(Anti-Particle Design)

FIO (FOUP In Out System)

Use

System for in / out the product (FOUP, FOSB) from OHT

Features

  • Minimized Lay-Out composition is available
    (800mm × 800mm)
  • Easy to move

Specification

  • PayloadFOUP, FOSB
  • Movement AxesX-axis, Turning
  • Speed0.25m/sec
  • CleanlinessClass 10@0.3㎛(Anti-Particle Design)